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ROM-KD-B | OMRON EEPROM Memory Cassette ROM-KD-B


OMRON ROM-KD-B Product information and technical parameters:
Brand: OMRON
Name: EEPROM Memory Cassette
Model: ROM-KD-B
Capacity: 32K word.
Access time: 150ns.
When using SYSMAC-CPT, can not be written in EPROM.
To write a program to the EPROM, use the standard PROM writer.
Before the EPPROM memory card into the CPU, to connect the EPROM to the EPROM memory card.
If you remove the EPROM memory card from the CPU,
Will not lose its data.

Model: C200HW-COM02-V1.
Specifications: One RS-232C port.General Information
The C200HS-SLK12 SYSMAC LINK fiber-optic module connects the PLC to the SYSMAC
LINK fiber-optic token bus peer-to-peer communications network. An external power supply option provides direct pass-through communications in case of modulName: Position Control Module OMRON ROM-KD-B.
Model: C200HW-NC213.
Control method: Open-loop, automatic trapezoid acceleration/deceleration ROM-KD-B
Control output sig-nals: Pulse-train outputs.
Controlled axes: 2.Name: Temperature Control Module.
Model: C200H-TC101.
Sensor: Platinum resistance thermometer: JPt100 Pt100.
Control output: Transistor output.Name: Heat/Cool Temperature Control Module.
Model: C200H-TV103 OMRON ROM-KD-B.
Sensor: Platinum resistance thermometer: JPt100, Pt100.
Control output: Current output(transistor output used for cooling outputs).100 to 120/200 to 240 VAC (Supports SYSMAC LINK and SYSMAC NET Link Systems.)UM: 15.2K words.
DM: 6K words.
EM: 6K words.
Instruction processing time (basic instructions): 0.15 µ.s min.
No. of I/O points: 1, 184 points.
Max. no.of con-necting Expansion I/O Racks: 3 Racks OMRON ROM-KD-B.
Max. no. of connecting High-density I/O Units(i.e., Group-2): Unavailable.
Max. no. of con-necting Special I/O Units: 10.
RS-232C: NO.Model: C200H-B7AI1.
I/O points: 16 points or 15points and 1 error input
Weight: 200g max.Connects Power Supply Adapter and SYSMAC NET Link Unit.
For 2 Unit.Model: C200H-MR833.
Description: RAM, 8K words, battery back-up.with clock(CPU21, CPU23 only).UM: 7.2K words.
DM: 6K words.
EM: --.
Instruction processing time (basic instructions): 0.3 µ.s min.
No. of I/O points: 880 points.
Max. no.of con-necting Expansion I/O Racks: 2 Racks.
Max. no. of connecting High-density I/O Units(i.e., Group-2): Unavailable.
Max. ROM-KD-B. no. of con-necting Special I/O Units: 10.
RS-232C: NO.UM: 15.2K words.
DM: 6K words.
EM: 6K words.
Instruction processing time (basic instructions): 0.15 µ.s min.
No. of I/O points: 1, 184 points.
Max. no.of con-necting Expansion I/OO Racks: 3 Racks ROM-KD-B.
Max. no. of connecting High-density I/O Units(i.e., Group-2): Unavailable.
Max. no. of con-necting Special I/O Units: 10.
RS-232C: NO.


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